UFLEX Appoints Vinod Hariharan as Executive Vice President for Holography Business

1738653099329.webp

Noida, February 4, 2025 – UFLEX Limited (NSE: UFLEX, BSE: 500148), a leading player in flexible packaging solutions, has announced the appointment of Mr. Vinod Hariharan as the Executive Vice President (Holography Business). The appointment is effective from February 4, 2025, and Mr. Hariharan has been designated as a Senior Management Personnel of the company in accordance with Regulation 16(1)(d) of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015.

Key Details of the Appointment

ParticularsDetails
NameMr. Vinod Hariharan
DesignationExecutive Vice President (Holography Business)
Date of AppointmentFebruary 4, 2025
TermFull-time Employment
Regulatory ComplianceSEBI Listing Regulations, 2015 (Regulation 30)

Mr. Vinod Hariharan’s Profile

Mr. Hariharan holds a B.Tech in Mechanical Engineering from NIT, Kozhikode, and has completed a Senior Management Program from IIM Kolkata. He brings over 28 years of experience in strategic planning, business development, channel management, digital marketing, sales, and general management roles. His professional background includes working with several international organizations, including Fortune 500 companies from American and European markets.

Corporate Strategy and Market Positioning

The appointment of Mr. Hariharan aligns with UFLEX’s strategic goals to strengthen its Holography Business segment, which plays a crucial role in anti-counterfeiting solutions and high-security printing. His expertise in business growth and international market expansion is expected to enhance UFLEX’s competitive edge in the global flexible packaging and security printing industry.

Conclusion

UFLEX continues to expand its leadership team with experienced professionals, reinforcing its commitment to innovation and global business expansion. With Mr. Hariharan’s appointment, the company is well-positioned to drive growth in its holography division and capitalize on emerging opportunities in security packaging solutions.
 
Back
Top